Burn In Oven
Description: Integrated Circuits (IC) and other electronic devices are burned in at elevated temperatures (eg 100-175℃) to stress and exercise the devices under test. The high temperatures force early failure, known as infant mortality, at this point rather than later when they are in use in a finished product. This process can greatly improve the reliability of the product.
Application: GAAT burn-in ovens are fabricated specifically for applications such as high dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC, RAM, ROM, microprocessors and other semiconductor devices.
Testing Standards: IEC 60068-3-5: 2018, IEC 60068-3-6: 2018, IEC 60068-2-1: 2007, IEC 60068-2-2: 2007, IEC 60068-2-14: 2009, GB/T 11158: 2008, GB/T 2423.2: 2008, GB/T 30435: 2013
Package: Each set protected with resin fiber and PP film, then put into Strong wooden case with operation manual and video inside.
Delivery: 20-30 days.
Technical Parameters
| Model | SZ-BIO-12C | SZ-BIO-24C | SZ-BIO-36C | SZ-BIO-48C | SZ-BIO-78C |
| BIB slots | 12 BIB slots | 24 BIB slots | 36 BIB slots | 48 BIB slots | 78 BIB slots |
| Size | Customized as per testing requirement | ||||
| Temperature range | RT+20℃～+200℃ | ||||
| Temperature fluctuation | ±0.5℃ | ||||
| Temperature deviation | ≤±2℃ | ||||
| Temperature uniformity | ≤±2℃ | ||||
| Heating rate | RT→+200℃≤25min | ||||
| Cooling rate | 200℃→50℃≤30min (fast cooling designed to save waiting time and improve fab productivity) | ||||
| Our strength | Highly customized oven design according to specific user needs catering to BIB, feed through, backplane and driver board dimensions.
Full range of sensors equipped (over-temperature protector in multiple spots, under-temperature sensor, airflow meter, air pressure differential sensor, interlock sensor etc.) |
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| Optional | Additional built-in refrigeration unit to provide minus temperature conditions to fulfill HTOL and LTOL test requirements. | ||||
Our advantages:
During burn-in the temperature rises as the air travels across the chamber due to the heat dissipated by the devices, our high volume air circulation fans can maintain temperature uniformity inside oven chamber. For some devices with excessive heat load while charged, we can also equip the additional water chiller to help maintain the consistent and accurate temperature inside the chamber.
GAAT also provides customized burn in oven designs to fit our customers’ existing BIB, feed thru, backplane, driver and monitoring boards designs. Additionally, we can also provide external PSUs and integrated PSU rack (in or aside oven chamber) and PSU sequence PLC together in our burn in oven set package.
Our customized design will take full consideration of the PCB alignments, air circulation, connection facility, durability of such equipment.
Please see the video about our burn in oven below.